| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a structure that eliminates the need to grind or cut a sealing resin and heat radiation surfaces so as to expose the heat radiation surfaces from the sealing resin. <P>SOLUTION: In the semiconductor device, a concave section 43 is provided to a second heat sink 40, and a first sealing resin 50 is provided in the concave section 43. Thus, the first sealing resin 50 is arranged in the concave section 43, so that a second heat radiation surface 41 positioned on the opposite side from a bottom surface 44 of the concave section 43 is not buried in the first sealing resin 50. Further, a top surface 51 of the first sealing resin 50 is positioned on the side of a first end surface 12 with respect to a first radiation surface 11. Consequently, the first heat radiation surface 11 is not covered with the first sealing resin 50 to be buried. Therefore, there is no need to grind or cut the first sealing resin 50 and the respective heat radiation surfaces 11 and 41 so as to expose the respective heat radiation surfaces 11 and 41 from the first sealing resin 50. <P>COPYRIGHT: (C)2011,JPO&INPIT |
