发明名称 METHOD FOR CUTTING WORKPIECE
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for cutting a workpiece with high accuracy along a predetermined cutting line without depending on the material of a workpiece being an object to be cut. <P>SOLUTION: The rear surface 1b of a workpiece 1A is bonded to the surface 10a of a workpiece 10A for decoupling by anodic bonding. Thereby, a crack 17 generated in the thickness direction of the workpiece 10A for decoupling from a melting treatment area 13 as a starting point reaches the surface 1a of the workpiece 1A continuously without mostly changing the direction thereof. After the workpieces 1A and 10A are cut, the workpiece 10A is removed from the workpiece 1A to obtain a chip 19. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011026177(A) 申请公布日期 2011.02.10
申请号 JP20090175835 申请日期 2009.07.28
申请人 HAMAMATSU PHOTONICS KK 发明人 UCHIYAMA NAOMI;KAWAGUCHI DAISUKE;SHIMOI HIDEKI
分类号 C03B33/09;B23K26/00;B23K26/38;B28D5/00;H01L21/301 主分类号 C03B33/09
代理机构 代理人
主权项
地址
您可能感兴趣的专利