| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring board that is superior in suppression of warpage of a substrate, can secure operation efficiency by handling as a substrate which is thick to some extent, and is adaptive even to a copper-clad laminate and also adaptive to a flexible substrate to be rolled. SOLUTION: The method of manufacturing the wiring board includes: sticking two substrates together via an adhesive within a frame-shaped range 0.1 to 50 mm inside outer circumferences of the two substrates into one substrate and forming wirings on both surfaces of the one substrate; and then removing adhesion parts stuck together through the adhesive to separate the one substrate into independent wiring boards. COPYRIGHT: (C)2011,JPO&INPIT |
