| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component mounting structure suppressed in generation of cracks in a soldered part. SOLUTION: The structure includes a land 11 formed on a circuit board 10, the electronic component 14 disposed at a position corresponding to the land 11 on the circuit board 10 and having the coefficient of thermal expansion different from that of the circuit board 10, an electrode 17 formed on a surface of the electronic component 14 which is different from an opposite surface 16 opposing the circuit board 10, the soldered part 18 connecting the electrode 17 with the land 11, and a restriction part 19 disposed in a region between the opposite surface 16 of the electronic component 14 and the land 11 to restrict intrusion of heated and molten solder into the region between the opposite surface 16 of the electronic component 14 and the land 11. COPYRIGHT: (C)2011,JPO&INPIT
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