发明名称 FORM CONTACT-BONDING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a form contact-bonding device which contact-bonds a form through a folding process with an applied releasable adhesive and is designed to avoid a stopping action of an overcurrent circuit-breaker when a motor overcurrent occurs during contact-bonding. SOLUTION: This form contact bonding device includes a first drive part 34 which drives a first motor M1 for sending out the form to the contact-bonding roller side, and a second drive part 36 which drives a second motor M2 for making a uniform rotation of the contact bonding roller at a preset velocity. In addition, a current detection arithmetic means 37 detects motor current running through the second motor M2, and calculates a value of cumulative current consumed in a specified time unit or an average value of the cumulative current per specified time. Further, a decision means 44 acquires the calculated value per specified time and determines whether the calculated value exceeds a preset reference value or not. A first drive control means 45 outputs a control signal to the first drive part 34 so as to control the rotation of the first motor M1, according to the results of the decision. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011025597(A) 申请公布日期 2011.02.10
申请号 JP20090175564 申请日期 2009.07.28
申请人 TOPPAN FORMS CO LTD 发明人 SHIMIZU HIROSHI
分类号 B31D1/00;B42D15/02 主分类号 B31D1/00
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