| 摘要 |
PURPOSE:To obtain an apparatus in which the displacement of the parting faces of upper and lower dies in its inward direction is eliminated by so securing the chase blocks of the upper and lower dies in a plane on a surface plate as to be movable at a predetermined distance, and providing X direction positioning block and Y direction positioning block of the upper and lower dies at the chase block sides. CONSTITUTION:A lead frame in which a semiconductor element is secured is positioned and placed, and a chase block 6 having a cavity 7 for sealing the element is secured onto a surface plate 11. In such a pair of upper and lower metal molds, the blocks of the upper and lower dies are so secured in a plane on the surface plate 11 as to be movable at a predetermined distance, and X direction positioning block 23 and Y direction positioning block 13 of the upper and lower dies are provided at the block 6. For example, a gap C is provided between the block 6 and a holder 15. Even if the upper and lower chase blocks 6 are displaced at the time of clamping the upper and lower dies, the blocks 6 are forcibly corrected at the displacement within the plane by the engagement with the blocks 13, 23. |
