| 摘要 |
PURPOSE:To produce a fluororesin multilayer board of good plate thickness precision without the need of a high temperature burning device by superposing a fluororesin film and glass fabric on the upper face and/or the lower face of an inner layer material of the required number and further heating, pressurizing and shaping a laminated body in which an outer layer material is arranged on the outmost layer thereof under low pressure. CONSTITUTION:An electric circuit is formed on both the faces of both-face copper lining glass base material fluororesin laminated layer board to be an inner layer material, a tetrafluoroethylene resin film is arranged on the upper and the lower faces of the inner layer material respectively and further glass fabric is arranged the upper and the lower faces thereof. A laminated layer body in which a copper foil with a bonding agent layer is arranged on the outmost layer thereof and the bonding agent layer on the inside thereof are sandwiched between two stainless steel formed plates to house in a silicon rubber-made bag, the bag inside is decompressed to heat, pressurize and form and a four-layer circuit multilayer board can be obtained. Thereby the effect for improving plate thickness precision can be obtained without the need of a high temperature burning device. |
