| 摘要 |
The device has an elastic contact element comprising a contacting-end section (18) that is provided for connection with a connection element (14) of an interconnect device (12) e.g. substrate made from aluminum oxide, of a power semiconductor module, where the connection element has a chip component (10) with a centering recess (16) for the end section. The chip component is designed as an automatic surface mounted device-assembled component and completely made from metal, where the chip component is provided with an electro-plating (20). |
