INSPECTING APPARATUS FOR WIRE

摘要

PURPOSE: A wire inspection apparatus is provided to determine whether the wire is defective or not by calculating the height of the wire using the distance information between the wire and the shadow of the wire. CONSTITUTION: A lighting unit(10) emits the illuminating light having the predetermined incident angle(&thgr;1) for the perpendicular axis of a chip package(40) to cast the shadow of the wire. A photographing unit(20) is arranged with the predetermined accepting angle(&thgr;2) for the perpendicular axis of the chip package in order to get the total reflection image of the chip package surface.