APPARATUS FOR PLATING

摘要

PURPOSE: A plating device is provided to improve the plating efficiency by forming a flow field for directly supplying plating liquid to an object as well as an electric filed. CONSTITUTION: A plating device comprises an anode electrode(10), a cathode electrode(30), and a plating bath(40). The anode electrode comprises an insoluble anode(12) with an electrode surface, an insulation part(20) for electrically insulating the parts except the electrode surface, and an anode basket(16) accommodating a soluble electrode(17). The cathode electrode is electrically connected to the object. The plating bath accommodates plating liquid in which the anode and the cathode electrode are submerged.