| 摘要 |
PURPOSE: A semiconductor package and a manufacturing method thereof are provided to be capable of improving the adhesive force between a semiconductor chip and a board, and minimizing the thermal damage of the semiconductor package. CONSTITUTION: A plurality of bumps(34) are formed on the surface of a semiconductor chip(33) by carrying out an electroless plating process using nickel and gold. A plurality of inner leads(32) are formed on the surface of a board(31) corresponding to the bumps of the semiconductor chip. An adhesive is coated on the substrate. The semiconductor chip is fixed to a bonding head(35). The adhesive coated board is fixed to a bonding stage(36). The semiconductor chip and the board are aligned with each other. A bonding process between the bump and the inner lead is performed by using laser beam. |
