| 摘要 |
PURPOSE: A resin composition is provided to improve adhesiveness between an insulating film or a surface protection film and a substrate on which the films are formed, and to form an interlayer insulating film or a surface protection film without occurrence of melt at the final heating step. CONSTITUTION: A resin composition for an insulating film or a surface protection film of an electronic part comprises: (A) a polymer which has a structural unit shown by the following formula (I), and an acidic functional group or a group derived therefrom at both of the terminals, wherein X1 is a di- to octa-valent organic group, Y1 is a di- to octa-valent organic group, R1 is a hydrogen atom or an organic group having 1 to 20 carbon atoms, R2 is a hydrogen atom or a monovalent organic group, when plural R1s or R2s exist, the plural R1s or R2s may be the same or different, p and q are independently an integer of 0 to 4, l and m are independently an integer of 0 to 2, and n is an integer of 2 or more which indicates the number of the structural units; (B) a solvent; and (C) a compound shown by the following formula (II), wherein R3 is a monovalent organic group.
|
