THROUGH SILICON VIA TYPE SEMICONDUCTOR INTEGRATED CIRCUIT

摘要

PURPOSE: A semiconductor integrated circuit of through silicon via method is provided to improve the signal transmission speed by rapidly shift the transmission signal to a target level. CONSTITUTION: A master chip(110) and a slave chip(120) are deposited. The master chip comprises a transmission unit(111), a receiver(112), and a termination(113). The slave chip comprises a transmission unit(121) and a receiver unit. The transmission unit and the receiver unit are embodied with the same circuit configuration.