| 摘要 |
PURPOSE: A layout structure for a semiconductor device is provided to supply power to an internal circuit by improving power transfer capacity. CONSTITUTION: A plurality of pad(20A,20B,20C,20D) are arranged in a third metal wiring layer by predetermined space between them. The first power mesh comprises a first power connection line and a plurality of first power lines(VDD) which are arranged outside of the pads. . A second power mesh comprises a plurality of second power lines(VSS) which are arranged outside of the pads . The third power mesh comprises a plurality of third power lines(VSS), in a second metal wiring layer, which are arranged the outside of the pads. . A fourth power mesh comprises a plurality of fourth power lines(VDD) which is arranged between the pads and the third power lines.
|
