| 摘要 |
PURPOSE: A method for repairing fuse in a semiconductor device is provided to prevent a problem which is generated in a repair process using a fuse blowing method by cutting a fuse to be repaired through etching. CONSTITUTION: A plurality of fuses(12) are formed on a substrate, and a fuse unit has a fuse box exposing a part of the fuses. A photosensitive pattern(15A), having an open area exposing a part of the fuse to be repaired, is formed. The fuse is etched by photosensitive pattern as a etch barrier. The photosensitive pattern is removed.
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