OPTICAL WIRING BOARD AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: An optical wiring board and a manufacturing method thereof are provided to prevent damage to an optical waveguide due to the heat and pressure when a substrate is laminated. CONSTITUTION: A solder resist is formed in the outmost layer of a substrate(S110). A photoresist layer is formed on the substrate(S130). An opening unit is patterned in a photoresist layer through an exposure and development process(S140). An optical waveguide is formed within an opening(S150). A remaining photoresist layer is removed(S160).