发明名称 |
Rotation joint and semiconductor device having the same |
摘要 |
Provided are a rotation joint capable of compensating for a mismatch due to thermal expansion and a semiconductor device having the same. The rotation joint can include a support member and a first contact member coupled to a first portion of the support member such that a surface of the first contact member is moveable relative to a surface of the support member adjacent to the first contact member. The first contact member can include solder material.
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申请公布号 |
US7884487(B2) |
申请公布日期 |
2011.02.08 |
申请号 |
US20070942483 |
申请日期 |
2007.11.19 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
YANG SE-YOUNG;LEE WANG-JU |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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