发明名称 |
Electrodeposited copper foil with carrier foil on which a resin layer for forming insulating layer is formed, copper-clad laminate, printed wiring board, method for manufacturing multilayer copper-clad laminate, and method for manufacturing printed wiring board |
摘要 |
An electrodeposited copper foil with carrier foil on which a resin layer for forming an insulating layer is formed, comprising a carrier foil, a bonding interface layer, an electrodeposited copper foil with smooth surfaces on both sides and a resin layer. The resin layer is composed of 20 to 80 parts by weight of an epoxy resin and a curing agent, 20 to 80 parts by weight of a solvent soluble aromatic polyamide resin polymer and optionally a curing accelerator in a suitable amount.
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申请公布号 |
US7883783(B2) |
申请公布日期 |
2011.02.08 |
申请号 |
US20050593152 |
申请日期 |
2005.03.15 |
申请人 |
MITSUI MINING & SMELTING CO., LTD. |
发明人 |
NAGATANI SEIJI |
分类号 |
B32B15/08;H05K1/09;B32B15/088;B32B15/092;H05K1/03;H05K3/00;H05K3/02;H05K3/42;H05K3/46 |
主分类号 |
B32B15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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