发明名称 Semiconductor device and method of fabricating the same
摘要 Provided are a semiconductor device and a method of fabricating the semiconductor device. The semiconductor device includes a first conductive well region in a semiconductor substrate and a second conductive well region on or in the first conductive well region. A gate electrode is in a trench on a gate insulation layer, and the trench is in the second conductive region and the first conductive well region. A drain includes a drain insulation layer, a (polysilicon) shield layer, and drain plug. The drain insulation layer is in a trench in the second conductive region and the first conductive well region. The shield layer encloses the drain plug. A lower portion of the drain plug contacts the second conductive well region. A first conductive source region is at a side of the gate electrode.
申请公布号 US7884419(B2) 申请公布日期 2011.02.08
申请号 US20070002096 申请日期 2007.12.14
申请人 DONGBU HITEK CO., LTD. 发明人 JANG BYUNG TAK
分类号 H01L29/76 主分类号 H01L29/76
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