A heat dissipation device comprises a heat spreader and heat pipe soldered thereon via a heat conducting material. The heat spreader defines a plurality of cavities in an inner side surface thereof, the heat conducting material is received in the cavities, and the heat pipe contacts and is soldered to the inner side surface of the heat spreader.
申请公布号
US7885075(B2)
申请公布日期
2011.02.08
申请号
US20090396477
申请日期
2009.03.03
申请人
FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.;FOXCONN TECHNOLOGY CO., LTD.