| 发明名称 |
Pattern substrate including conductive pattern of overlapping circular patterns disposed on substrate |
| 摘要 |
A pattern substrate including a conductive pattern of overlapping circular patterns disposed on a substrate is provided.
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| 申请公布号 |
US7884537(B2) |
申请公布日期 |
2011.02.08 |
| 申请号 |
US20080029967 |
申请日期 |
2008.02.12 |
| 申请人 |
RICOH COMPANY, LTD. |
发明人 |
SEKIYA TAKURO |
| 分类号 |
H01J63/04;B41J2/01;B41J3/407;H01J1/316;H01J9/02;H01J29/04;H01J31/12 |
主分类号 |
H01J63/04 |
| 代理机构 |
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