发明名称 |
Use of discrete conductive layer in semiconductor device to re-route bonding wires for semiconductor device package |
摘要 |
A semiconductor package assembly may include a lead frame having a die bonding pad and plurality of leads coupled to the first die bonding pad. A vertical semiconductor device may be bonded to the die bonding pad. The device may have a conductive pad electrically connected to one lead through a first bond wire. An electrically isolated conductive trace may be formed from a layer of conductive material of the first semiconductor device. The conductive trace provides an electrically conductive path between the first bond wire and a second bond wire. The conductive path may either pass underneath a third bond wire thereby avoiding the third bond wire crossing another bond wire, or the conductive path may result in a reduced length for the first and second bond wires that is less than a predetermined maximum length.
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申请公布号 |
US7884454(B2) |
申请公布日期 |
2011.02.08 |
申请号 |
US20080209106 |
申请日期 |
2008.09.11 |
申请人 |
ALPHA & OMEGA SEMICONDUCTOR, LTD |
发明人 |
LU JUN;BHALLA ANUP;WANG XIAOBIN;CHANG ALLEN;HU MAN SHENG;ZHANG XIAOTIAN |
分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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