发明名称 Wiring board and method of manufacturing the same
摘要 A wiring board includes an insulating layer in which a semiconductor chip is embedded, and a wiring structure connected to the semiconductor chip. A reinforcing member reinforcing the insulating layer is embedded in the insulating layer. This enables reduction in a thickness of the wiring board and a suppression of warpage of the wiring board.
申请公布号 US7884484(B2) 申请公布日期 2011.02.08
申请号 US20060372916 申请日期 2006.03.10
申请人 SHINKO ELECTRIC INDUSTRIES CO., LTD. 发明人 YAMANO TAKAHARU;SUNOHARA MASAHIRO;IIZUKA HAJIME;KOYAMA TETSUYA
分类号 H01L23/48;H01L23/52;H01L29/40 主分类号 H01L23/48
代理机构 代理人
主权项
地址