发明名称 |
Wiring board and method of manufacturing the same |
摘要 |
A wiring board includes an insulating layer in which a semiconductor chip is embedded, and a wiring structure connected to the semiconductor chip. A reinforcing member reinforcing the insulating layer is embedded in the insulating layer. This enables reduction in a thickness of the wiring board and a suppression of warpage of the wiring board.
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申请公布号 |
US7884484(B2) |
申请公布日期 |
2011.02.08 |
申请号 |
US20060372916 |
申请日期 |
2006.03.10 |
申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
YAMANO TAKAHARU;SUNOHARA MASAHIRO;IIZUKA HAJIME;KOYAMA TETSUYA |
分类号 |
H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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