发明名称 |
Substrate holding mechanism, substrate polishing apparatus and substrate polishing method |
摘要 |
A substrate holding mechanism, a substrate polishing apparatus and a substrate polishing method have functions capable of minimizing an amount of heat generated during polishing of a substrate to be polished and of effectively cooling a substrate holding part of the substrate holding mechanism, and also capable of effectively preventing a polishing solution and polishing dust from adhering to an outer peripheral portion of the substrate holding part and drying thereon. The substrate holding mechanism has a mounting flange, a support member 6 and a retainer ring. A substrate to be polished is held on a lower side of the support member surrounded by the retainer ring, and the substrate is pressed against a polishing surface of a polishing table. The mounting flange is provided with a flow passage contiguous with at least the retainer ring. A temperature-controlled gas is supplied through the flow passage to cool the mounting flange, the support member and the retainer ring. The retainer ring is provided with a plurality of through-holes communicating with the flow passage to spray the gas flowing through the flow passage onto the polishing surface of the polishing table. |
申请公布号 |
US7883394(B2) |
申请公布日期 |
2011.02.08 |
申请号 |
US20080184032 |
申请日期 |
2008.07.31 |
申请人 |
EBARA CORPORATION;KABUSHIKI KAISHA TOSHIBA |
发明人 |
TOGAWA TETSUJI;WATANABE TOSHIO;YANO HIROYUKI;TOYOTA GEN;IWADE KENJI;TATEYAMA YOSHIKUNI |
分类号 |
B24B49/00;B24B37/04;B24B37/30;B24B37/32;B24B41/06;B24B49/14;B24B55/02;H01L21/304 |
主分类号 |
B24B49/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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