发明名称 HEATING APPARATUS, SUBSTRATE PROCESSING APPARATUS EMPLOYING THE SAME, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, AND INSULATOR
摘要 <p>A heating apparatus comprises a heating element, an inner shell for supporting the heating element, an outer shell disposed along the outer boundary of the inner shell, a cooling medium passage for conveying a cooling medium between the inner shell and the outer shell, a first opening provided in the inner shell, a second opening provided in the outer shell, and a partition arranged to extend from the first opening to the second opening for developing at least a space separated from the cooling medium passage and between the inner shell and the outer shell. The heating apparatus further comprises an insulator for shutting up a gap provided between the partition and the second opening.</p>
申请公布号 KR101012082(B1) 申请公布日期 2011.02.07
申请号 KR20080059565 申请日期 2008.06.24
申请人 发明人
分类号 H01L21/324 主分类号 H01L21/324
代理机构 代理人
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