发明名称 |
PLASMA TREATMENT APPARATUS, METHOD FOR FORMING FILM, AND METHOD FOR MANUFACTURING THIN-FILM TRANSISTOR |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a plasma treatment apparatus capable of forming a homogeneous film of good quality. <P>SOLUTION: The plasma treatment apparatus is configured such that: an upper electrode has projected portions provided with first introduction holes and recessed portions provided with second introduction holes; the first introduction hole of the upper electrode is connected to a first cylinder filled with a gas which is not likely to be dissociated; the second introduction hole is connected to a second cylinder filled with a gas which is likely to be dissociated; the gas which is not likely to be dissociated is introduced into a reaction chamber from an introduction port of the first introduction hole provided on a surface of the projected portion of the upper electrode; and the gas which is likely to be dissociated is introduced into the reaction chamber from an introduction port of the second introduction hole provided on a surface of the recessed portion. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
申请公布号 |
JP2011023714(A) |
申请公布日期 |
2011.02.03 |
申请号 |
JP20100139554 |
申请日期 |
2010.06.18 |
申请人 |
SEMICONDUCTOR ENERGY LAB CO LTD |
发明人 |
YAMAZAKI SHUNPEI;INOUE TAKAYUKI;KIKUCHI ERUMU;INOUE HIROTAKA |
分类号 |
H01L21/31;C23C16/455;H01L21/336;H01L29/786 |
主分类号 |
H01L21/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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