发明名称 PLASMA TREATMENT APPARATUS, METHOD FOR FORMING FILM, AND METHOD FOR MANUFACTURING THIN-FILM TRANSISTOR
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a plasma treatment apparatus capable of forming a homogeneous film of good quality. <P>SOLUTION: The plasma treatment apparatus is configured such that: an upper electrode has projected portions provided with first introduction holes and recessed portions provided with second introduction holes; the first introduction hole of the upper electrode is connected to a first cylinder filled with a gas which is not likely to be dissociated; the second introduction hole is connected to a second cylinder filled with a gas which is likely to be dissociated; the gas which is not likely to be dissociated is introduced into a reaction chamber from an introduction port of the first introduction hole provided on a surface of the projected portion of the upper electrode; and the gas which is likely to be dissociated is introduced into the reaction chamber from an introduction port of the second introduction hole provided on a surface of the recessed portion. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011023714(A) 申请公布日期 2011.02.03
申请号 JP20100139554 申请日期 2010.06.18
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 YAMAZAKI SHUNPEI;INOUE TAKAYUKI;KIKUCHI ERUMU;INOUE HIROTAKA
分类号 H01L21/31;C23C16/455;H01L21/336;H01L29/786 主分类号 H01L21/31
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