发明名称 CONNECTION STRUCTURE OF SUBSTRATE, AND DISPLAY DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a connection structure of a substrate capable of preventing lowering of electrical connection reliability between a substrate and a part to be connected with the substrate even when adhesion of the substrate with a connection member is enhanced, and a display device using the same. SOLUTION: This connection structure is a connection structure of an active matrix substrate 5 to which a source-gate driver (a part to be connected) 16 is connected using an anisotropic conductive film (connection member) 25. The connection structure includes: an electric wiring (electrode part) 20 which is formed on the surface of the active matrix substrate 5, and to which a bump (electrode terminal) 16a provided in the source-gate driver 16 is electrically connected; and an organic insulation film 24 provided on the surface of the active matrix substrate 5 and adhered to the anisotropic conductive film 25, in which in at least one of the organic insulation film 24 and the anisotropic conductive film 25, a silane coupling agent is blended. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011023510(A) 申请公布日期 2011.02.03
申请号 JP20090166666 申请日期 2009.07.15
申请人 SHARP CORP 发明人 MATSUI TAKASHI;SHIODA MOTOJI
分类号 H01L21/60;G02F1/1345;G09F9/00 主分类号 H01L21/60
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