发明名称 METHOD FOR BONDING OBJECT
摘要 PROBLEM TO BE SOLVED: To stably bond a jewel or the like when a base portion is small and the amount of adhesive is restricted to a small amount. SOLUTION: At least either one of an object 1 and the base portion 3 is heated, heated hot-melt adhesive 4 is applied to the heated object 1 or base portion 3, the object 1 and the base portion 3 are brought into abutment on each other via the hot-melt adhesive 4, and the hot-melt adhesive 4 is hardened. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011019724(A) 申请公布日期 2011.02.03
申请号 JP20090167211 申请日期 2009.07.15
申请人 MORI YUKIKO;SUGIURA KOHEI 发明人 MORI YUKIKO;SUGIURA KOHEI
分类号 A44C27/00 主分类号 A44C27/00
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