| 摘要 |
<p>A flexible circuit module and related methods of manufacturing and applications for the flexible circuit module are provided. The flexible circuit module (200) comprises a flexible substrate (220), at least one flexible chip element (210), and a flexible top layer (240) disposed over the flexible substrate (220) and the flexible chip element (210). According to an aspect, a flexible circuit module is used in flexible electronic devices. According to another aspect, a flexible circuit module is attached to the inner surface of an electronic device and connected to a main board of the device. According to another aspect, a flexible circuit module is used in the place of a current printed circuit board (PCB) in a PCB Assembly (PCBA). According to another aspect, a flexible circuit module is rolled up and used inside an electronic device. According to another aspect, a flexible circuit module is molded.</p> |
