| 摘要 |
PROBLEM TO BE SOLVED: To provide a die-bonding film high in heat conductivity and excelling in heat radiation capability, and a dicing/die-bonding film including the die-bonding film. SOLUTION: This exoergic die-bonding film for sticking and fixing a semiconductor element on a sticking object includes at least: a thermoplastic resin; a thermosetting resin; and a thermally-conductive filler having a heat conductivity≥12 W/m K, wherein the content of the thermally-conductive filler is 50-120 wt.% with respect to the total of an organic resin constituent and the thermally-conductive filler. COPYRIGHT: (C)2011,JPO&INPIT |
