发明名称 COMPOSITION FOR METAL PLATING COMPRISING SUPPRESSING AGENT FOR VOID FREE SUBMICRON FEATURE FILLING
摘要 According to the present invention a composition is provided comprising at least one source of metal ions and at least one additive obtainable by reacting a) a polyhydric alcohol condensate compound derived from at least one polyalcohol of formula (I) X(OH)n (I) by condensation with b) at least one alkylene oxide to form a polyhydric alcohol condensate comprising polyoxyalkylene side chains, wherein n is an integer from 3 to 6 and X is an n-valent linear or branched aliphatic or cycloaliphatic radical having from 2 to 10 carbon atoms, which may be substituted or unsubstituted.
申请公布号 WO2011012462(A2) 申请公布日期 2011.02.03
申请号 WO2010EP60276 申请日期 2010.07.16
申请人 BASF SE;ROEGER-GOEPFERT, CORNELIA;RAETHER, ROMAN BENEDIKT;HAAG, ALEXANDRA;MAYER, DIETER;EMNET, CHARLOTTE 发明人 ROEGER-GOEPFERT, CORNELIA;RAETHER, ROMAN BENEDIKT;HAAG, ALEXANDRA;MAYER, DIETER;EMNET, CHARLOTTE
分类号 C25D3/02 主分类号 C25D3/02
代理机构 代理人
主权项
地址