| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus for cleaning a wafer having a circular recess on a rear surface corresponding to a device region. SOLUTION: The wafer cleaning apparatus for cleaning a circular recess 31 of a wafer 11 having a circular recess 31 formed on the rear surface corresponding to a device region 17 and an annular reinforcing part 33 formed on the outer circumference of the circular recess 31 includes: a cleaning means having a disc-like cleaning pad 84 abutting on the bottom surface of the circular recess 31 of a wafer held on a rotary chuck table 46 and rotating; a vertically driving means 80 for allowing the cleaning pad 84 to be positioned higher than the height of the annular reinforcing part 33 and moving the cleaning means between a retracting position; and a horizontally driving means 70 for horizontally swinging the cleaning pad 84 positioned at the cleaning position. The total of the distance of reciprocation of the cleaning pad 84 by the horizontally driving means 70 and the diameter of the cleaning pad 84 is larger than the radius of the circular recess 31 and not larger than the diameter, and the center of the cleaning pad 84 moves through the center of the circular recess 31. COPYRIGHT: (C)2011,JPO&INPIT
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