发明名称 |
IC Test Substrate for Testing Various Signals |
摘要 |
The present invention provides on IC test substrate for testing various signals, a combined flexible and rigid PCB included in the structure is applicable to perform a mission including for example: stabilizing power input/output, signal transfer by a connector; general, power, and high frequency signal transmission in preserved integrity state.
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申请公布号 |
US2011025357(A1) |
申请公布日期 |
2011.02.03 |
申请号 |
US20090534131 |
申请日期 |
2009.08.02 |
申请人 |
LEE WEN-TSUNG;TSENG KUAN-CHUN |
发明人 |
LEE WEN-TSUNG;TSENG KUAN-CHUN |
分类号 |
G01R31/02;G01R31/20;G01R31/26 |
主分类号 |
G01R31/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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