发明名称 IC Test Substrate for Testing Various Signals
摘要 The present invention provides on IC test substrate for testing various signals, a combined flexible and rigid PCB included in the structure is applicable to perform a mission including for example: stabilizing power input/output, signal transfer by a connector; general, power, and high frequency signal transmission in preserved integrity state.
申请公布号 US2011025357(A1) 申请公布日期 2011.02.03
申请号 US20090534131 申请日期 2009.08.02
申请人 LEE WEN-TSUNG;TSENG KUAN-CHUN 发明人 LEE WEN-TSUNG;TSENG KUAN-CHUN
分类号 G01R31/02;G01R31/20;G01R31/26 主分类号 G01R31/02
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