ULTRASOUND IMAGING TRANSDUCER ACOUSTIC STACK WITH INTEGRAL ELECTRICAL CONNECTIONS

摘要

An ultrasound transducer that includes a backing layer 11, an insulating layer 15a disposed on top of the backing layer, and a plurality of conductive traces 15b disposed on top of the insulating layer are disclosed. Each of the conductive traces has an upper face. A plurality of transducer elements 20, each having (a) a core of piezoelectric material and (b) a conductive coating disposed beneath the core, are bonded directly to the upper face of a respective one of the plurality of conductive traces. Methods for fabricating ultrasound transducers are also disclosed.