| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device that improves productivity by improving electrical characteristics and mechanical strength of a semiconductor chip laminate and simplifying a formation process. <P>SOLUTION: A method of manufacturing the semiconductor device includes a first connection process S101 (S101a, S101b, and S101c) in which a pad on a semiconductor chip is connected with a first end of a conductive connection material, a chip lamination process S102 (S102a and S102b) in which the semiconductor chip is laminated to form a chip laminate, and a second connection process S103 in which the chip laminate is mounted on the mounting face of a substrate and a second end of the conductive connection material is conductively connected with a connection terminal of the substrate. The first connection process S101 (S101a, S101b, and S101c) has a waveform formation process in which the conductive connection material is formed into a wave form. <P>COPYRIGHT: (C)2011,JPO&INPIT |
