| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin composition suitable for a solder resist having both an excellent adhesiveness with copper wiring, and a high desmear tolerance. <P>SOLUTION: The resin composition comprises (A) a specific epoxy resin, (B) a specific triazine-containing novolac phenol resin, and (C) a specific imidazole derivative and/or cyclic amidine derivative. <P>COPYRIGHT: (C)2011,JPO&INPIT |
