| 摘要 |
PROBLEM TO BE SOLVED: To provide solder composition that suppresses union between solder particles and also suppresses generation of solder bridge. SOLUTION: The solder composition 10 comprises a large number of solder particles 11 and a liquid body 12 (liquid material) containing fatty acid ester oil as a base material and tetravalent organic acid tin salt such as tetra (stearic acid) tin (IV) to be added to the fatty acid ester oil. The solder composition 10 is used, for example, for forming a solder bump on a pad electrode 22. COPYRIGHT: (C)2011,JPO&INPIT
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