| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a structure of a control collapse chip connection (C4) and its manufacturing method, and particularly, a structure to improve reliability of lead-free C4 interconnection and its method. <P>SOLUTION: The structure includes a ball limited metalization (BLM) layer and a solder ball of control collapse chip connection (C4) formed on the BLM layer. Moreover, the structure includes the final metal pad layer under the BLM layer and a cap layer under the final metal pad layer. Then the structure includes an air gap between the final metal pad layer and one of the BLM layer and cap layer under the C4 solder ball. <P>COPYRIGHT: (C)2011,JPO&INPIT |
