| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having transparency and showing proper resolution and proper adhesion to ground. <P>SOLUTION: The photosensitive resin composition includes a resin (A), a photopolymerization initiator (B), and a specific monomer (C), wherein the resin (A) is a resin obtained by: a compound (A1) having a tricyclodecane skeleton or a dicyclopentadiene skeleton and an unsaturated bond in a molecule; a compound (A2) having an epoxy group and an unsaturated bond within a molecule; a compound (A3) having an unsaturated bond other than the compounds (A1) and (A2) are copolymerized to obtain a copolymer (A6), with the obtained copolymer (A6) is reacted with a compound (A4) having an unsaturated monobasic acid to obtain a copolymer (A7); and the obtained copolymer (A7) is made to react with a polybasic acid anhydride (A5). <P>COPYRIGHT: (C)2011,JPO&INPIT |
