| 摘要 |
<p>Disclosed is a film-forming apparatus (10) which includes a cathode unit (68) that includes: an electrode plate (76) having a voltage applied thereto; a channel (92) for a temperature adjusting fluid, said channel being provided on the electrode plate (76) and having the temperature adjusting fluid circulating therein; a shower plate (75), which is in contact with the electrode plate (76) and has a plurality of holes (74), through which a process gas is supplied toward the substrate (W) surface, on which a film is to be formed; a heat exchanging plate (91), which is provided between the electrode plate (76) and the shower plate (75), and is in contact with the electrode plate (76) and the shower plate (75); and a gas channel (107), which introduces the process gas into the heat exchanging plate (91), guides the process gas, which has been introduced into the heat exchanging plate (91), into the holes (74) of the shower plate (75), and which is provided on the heat exchanging plate (91). The film-forming apparatus also includes an anode (67) which is disposed to face the cathode unit (68) by being spaced apart from the cathode unit.</p> |
