发明名称 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device which when the same kind of a semiconductor material as that of a semiconductor layer is used as a substrate for growing the semiconductor layer making up a semiconductor element structure, allow a recognizable alignment mark to be formed at the time of a light exposure process following the growth of the semiconductor layer. <P>SOLUTION: On a substrate 101 made of a material transparent to a light source for alignment mark detection, a second alignment mark 120, which is made of a material having a refraction factor different from that of the substrate 101 is formed. Subsequently, a GaN-based epitaxial layer containing an active layer 105 is formed on the substrate 101 to fill the second alignment mark 120. Then, light exposure alignment to the GaN-based epitaxial layer is carried out referring to the second alignment mark 120. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011023453(A) 申请公布日期 2011.02.03
申请号 JP20090165496 申请日期 2009.07.14
申请人 PANASONIC CORP 发明人 SAMONJI KATSUYA;KAWAGUCHI MASANARI;HAGINO HIROYUKI
分类号 H01L21/027;H01L21/205;H01S5/16;H01S5/343 主分类号 H01L21/027
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