发明名称 |
CONDUCTIVE BALL MOUNTING METHOD AND APPARATUS |
摘要 |
There is provided a method of mounting conductive balls on pads on a substrate. The method includes: (a) placing the substrate having the pads coated with an adhesive over a container for containing the conductive balls therein and whose top surface is open such that the pads faces the top surface of the container; and (b) throwing up the conductive balls in the container by moving the container up and down at a given stroke, thereby allowing the conductive balls to adhere to the adhesive coated on the pads. Step (b) is repeatedly performed.
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申请公布号 |
US2011023292(A1) |
申请公布日期 |
2011.02.03 |
申请号 |
US20100899947 |
申请日期 |
2010.10.07 |
申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
SAKAGUCHI HIDEAKI;IIDA KIYOAKI;TANAKA KAZUO |
分类号 |
B23P19/00 |
主分类号 |
B23P19/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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