发明名称 Device for lifting e.g. electrical component, from support film, has ejection element movable relative to outer element in ejection direction, and stamping element movable relative to ejection element and to outer element in direction
摘要 <p>The device (10) has an ejection element (40) for lifting a component (52) relative to a support film (50), and an outer element (20) for contacting the support film. The outer element includes an upper edge region (22) runs outside of a segment (44) of the ejection element. A stamping element (30) is partially present within the outer element, and the ejection element is movable relative to the outer element in an ejection direction. The stamping element is movable relative to the ejection element and relative to the outer element in the ejection direction. An independent claim is also included for a method for ejecting a component relative to a support film.</p>
申请公布号 DE102009035099(A1) 申请公布日期 2011.02.03
申请号 DE20091035099 申请日期 2009.07.29
申请人 SIEMENS ELECTRONICS ASSEMBLY SYSTEMS GMBH & CO. KG 发明人 ESCHENWECK, FRIEDRICH
分类号 H01L21/683;H01L21/50;H05K13/02 主分类号 H01L21/683
代理机构 代理人
主权项
地址