| 摘要 |
<p>Disclosed is a phenol compound that exhibits low viscosity and low moisture absorption at 50°C and that exhibits good mechanical properties when caused to react and cure with an epoxy resin. The phenol compound is obtained by reacting phenol (6), an aromatic aldehyde compound (7), and formaldehyde, whereby these compounds undergo condensation polymerization, and the aforementioned reaction results in the aforementioned phenol compound by one method of a method reacting phenol (6), the aromatic aldehyde compound (7), and formaldehyde in one step; a method reacting phenol (6) and the aromatic aldehyde compound (7), and then reacting with formaldehyde; or a method reacting the reaction product of phenol (6) and the aromatic aldehyde compound (7) with the reaction product of phenol (6) and formaldehyde; and the phenol compound is prepared such that the number of moles of the aromatic aldehyde compound (7) used is 0.1-4.0 times the number of moles of formaldehyde, and the rotational viscosity of the phenol compound measured by an E-type viscometer at 50°C is 0.01-100Pa·s.</p> |
