发明名称 CHIP MOLDING AND METHOD OF MANUFACTURING THE SAME
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a chip molding which can allow the whole surface of the chip molding to have a higher hardness than that of a molding comprising only a flexible polyurethane foam chip, and can reduce the weight of the molding, and a method of manufacturing the same. <P>SOLUTION: The chip molding 20 is formed by steps that a first chip material and a second chip material are mixed, a mixed material in which first chip pieces 24 and second chip pieces 26 are dispersed uniformly is packed, and at the same time, the first and the second chip pieces are combined by an adhesive to be integrated. The first chip material is an aggregate of the first chip pieces formed by crushing of a flexible polyurethane foam. The second chip material is an aggregate of the second chip pieces formed by crushing of a thermoplastic resin foam. Here, an average outside dimension of at least any one of the first chip piece and the second chip piece is controlled so that a bulk density of the first chip material and a bulk density of the second chip material may become equal. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011020355(A) 申请公布日期 2011.02.03
申请号 JP20090167457 申请日期 2009.07.16
申请人 TOKAI KOGYO CO LTD;NIPPO KOGYO KK 发明人 KOBAYASHI TETSUYA;SATO TAKATOSHI
分类号 B29C43/18;B29B17/00;B29C43/02;B29K23/00;B29K75/00;B29K105/26;C08L75/04 主分类号 B29C43/18
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