| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a TAB (Tape Automated Bonding) tape for semiconductor device with an inner lead of a fine pattern ensuring a wide top width sufficient to be surely bonded to an electrode pad of the mounted semiconductor device by eliminating particularly generation of a reduction in top width of the inner lead and defective bonding caused by the top width reduction without newly generating other inconveniences such as a pattern failure, a short-circuit failure and a reduction in insulating reliability, and also to provide a method of manufacturing the same. <P>SOLUTION: In the TAB tape for semiconductor device, the inner lead 6 and a wiring pattern 5 are formed by patterning a conductor foil 11 by a wet-etching process using an etchant to which an inhibitor constituted of an organic compound or an inorganic compound is added. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
