发明名称 DEVICE FOR TREATING INGOT AND METHOD FOR TREATING THE INGOT
摘要 PROBLEM TO BE SOLVED: To cut an ingot member while preventing insufficiency of electrolyte between the ingot member and a processing electrode due to bubbles generated from the electrode for processing. SOLUTION: A device for treating ingot treats the ingot members. The device for treating the ingot includes: treating vessels 20 for storing the electrolyte E; ingot receiving parts 30 for supporting the ingot members above the treating vessels 20; ingot moving parts 35 for immersing the ingot members in the electrolyte E in the treating vessels 20 by moving the ingot receiving parts 30 downward; the processing electrodes 10 for melting and cutting the ingot members in the electrolyte E so as to form a plurality of slice members by flowing current therein; and electrode moving parts 45 for vertically reciprocating the processing electrodes 10. The device for treating the ingot includes a control part 62 for controlling the electrode moving parts 45 to relatively reciprocate the processing electrodes 10 to the liquid face of the electrode E while the ingot members are being cut by the processing electrodes 10. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011020196(A) 申请公布日期 2011.02.03
申请号 JP20090165789 申请日期 2009.07.14
申请人 TOKYO ELECTRON LTD 发明人 KITAHARA SHIGENORI
分类号 B23H3/00;B23H3/10 主分类号 B23H3/00
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