| 发明名称 |
Method and Apparatus for Debonding a Submounted Substrate |
| 摘要 |
The present invention provides a debonding apparatus, a system comprising such apparatus, and methods for using such apparatus or system for the removal of flexible substrates (14) post-processing without damage to fabricated devices.
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| 申请公布号 |
US2011023672(A1) |
申请公布日期 |
2011.02.03 |
| 申请号 |
US20090921871 |
申请日期 |
2009.03.25 |
| 申请人 |
BLANCHARD ROBERT;REDNOUR STEVE R;LOY DOUGLAS |
发明人 |
BLANCHARD ROBERT;REDNOUR STEVE R.;LOY DOUGLAS |
| 分类号 |
B26D3/28;B26D1/00;B26D7/01;B26D7/06;B26D7/08;B26D7/10;G06F19/00 |
主分类号 |
B26D3/28 |
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