MULTILAYER SHEET FOR ENCAPSULATION OF ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE USING SAME

摘要

Disclosed is a multilayer sheet for encapsulation of an electronic device, wherein a first sheet and a second sheet (5) are laminated. The multilayer sheet for encapsulation of an electronic device is characterized in that the first sheet contains an acid-modified thermoplastic polyolefin resin, the second sheet (5) has a higher melting point than the first sheet, and the peel strength of the second sheet (5) with respect to the first sheet is 0.5-10.0 N/15 mm at 25°C. The multilayer sheet for encapsulation of an electronic device is capable of improving the production yield of the electronic device.