PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL FOIL-CLAD LAMINATE, AND PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a prepreg excellent in insulation reliability by suppressing occurrence of ion migration, while exhibiting excellent resistance to folding when fabricating a printed wiring board; a film with a resin; a metal foil with a resin and a metal foil-clad laminate; and a printed wiring board using these.

SOLUTION: The prepreg is formed by impregnating a fibrous base material with a resin composition, where the resin composition includes an acrylic resin, and in the IR spectrum of a cured product of the resin composition, the ratio (PCN/PCO) of the peak height (PCN) near 2,240 cm-1derived from a nitrile group to the peak height (PCO) near 1,730 cm-1derived from a carbonyl group is 0.001 or less.

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